Adaptable Void Filling Joint Prostheses for Specialized Environments
Legal Citation
Summary of the Inventive Concept
The present inventive concept relates to novel adaptations of void filling joint prostheses for specific, high-demand environments, such as high-security, disaster relief, extreme weather conditions, remote areas, and high-altitude settings.
Background and Problem Solved
The original patent, 'Void filling joint prosthesis and associated instruments,' addressed the need for efficient and effective joint replacement surgery. However, the original invention did not consider the unique challenges and requirements of specialized environments. The present inventive concept addresses these limitations by introducing adaptations that enable void filling joint prostheses to operate effectively in high-security, disaster relief, extreme weather conditions, remote areas, and high-altitude settings.
Detailed Description of the Inventive Concept
The new inventive concept comprises a family of void filling joint prostheses designed for specific, high-demand environments. For high-security needs, the prosthesis integrates a biometric authentication mechanism to verify the identity of the surgeon before implantation. For disaster relief, a portable void filling prosthesis kit is rapidly deployed, including a sterilized prosthesis and associated instruments, designed for rapid implantation in emergency situations. For extreme weather conditions, the prosthesis features a thermal insulation layer to reduce heat transfer between the prosthesis and surrounding bone. For remote areas, the prosthesis includes a self-contained power source, enabling data transmission to a remote monitoring station for post-operative monitoring. For high-altitude joint replacement, the prosthesis is pre-configured to compensate for lower air pressure and oxygen levels.
Novelty and Inventive Step
The present inventive concept introduces novel adaptations of void filling joint prostheses, addressing specific challenges and requirements of high-demand environments. The integration of biometric authentication, portable kits, thermal insulation, self-contained power sources, and high-altitude compensation mechanisms represent a significant departure from the original patent, providing a non-obvious and innovative solution for these specialized environments.
Alternative Embodiments and Variations
Alternative embodiments of the inventive concept could include variations in the biometric authentication mechanism, such as fingerprint or facial recognition. The portable kit could be designed for different types of joint replacement surgeries. The thermal insulation layer could be replaced with other heat management technologies. The self-contained power source could be adapted for different remote monitoring systems. The high-altitude compensation mechanism could be modified for different altitude ranges.
Potential Commercial Applications and Market
The present inventive concept has significant commercial potential in the orthopedic industry, particularly in the areas of high-security, disaster relief, extreme weather conditions, remote areas, and high-altitude joint replacement. The market for these specialized environments is substantial, with potential customers including government agencies, disaster relief organizations, and medical facilities operating in challenging environments.
CPC Classifications
| Section | Class | Group |
|---|---|---|
| A | A61 | A61B17/1675 |
| A | A61 | A61B17/164 |
| A | A61 | A61B17/17 |
| A | A61 | A61B17/1764 |
| A | A61 | A61F2/30724 |
| A | A61 | A61F2/30734 |
| A | A61 | A61F2/30767 |
| A | A61 | A61F2/38 |
| A | A61 | A61F2/3859 |
| A | A61 | A61F2/461 |
| A | A61 | A61B2090/036 |
| A | A61 | A61B2090/062 |
| A | A61 | A61F2002/3021 |
| A | A61 | A61F2002/3069 |
| A | A61 | A61F2002/3093 |
| A | A61 | A61F2002/30332 |
| A | A61 | A61F2002/30736 |
Original Patent Information
| Patent Number | US 11,857,205 |
|---|---|
| Title | Void filling joint prosthesis and associated instruments |
| Assignee(s) | Howmedica Osteonics Corp. |