Intelligent Void Filling Joint Prosthetics with Integrated Technologies
Legal Citation
Summary of the Inventive Concept
A novel system integrating AI, IoT, blockchain, and advanced materials to revolutionize joint replacement surgery by enabling real-time monitoring, personalized feedback, and optimized prosthesis placement.
Background and Problem Solved
The original patent addressed the limitations of traditional joint replacement surgery, particularly the need for precise bone resection and prosthesis placement. However, it did not account for the potential benefits of integrating advanced technologies to enhance patient outcomes and streamline the surgical process. The new inventive concept addresses this limitation by incorporating AI-based sensors, IoT-enabled instruments, blockchain-based tracking, and novel materials to create a more efficient, effective, and personalized joint replacement system.
Detailed Description of the Inventive Concept
The new inventive concept comprises a void filling prosthesis with an integrated AI-based sensor for real-time monitoring of bone density. This sensor data is transmitted to a blockchain-based tracking system for inventory management, ensuring accurate and efficient tracking of prosthetic components. Additionally, the system incorporates machine learning algorithms to predict optimal prosthesis placement, IoT-enabled surgical instruments for real-time feedback, and a novel, porous material infused with micro-sensors for real-time monitoring of implant performance. The system is integrated with a cloud-based analytics platform for personalized patient care and a surgical planning platform utilizing AI-driven simulations to optimize prosthesis placement.
Novelty and Inventive Step
The new claims introduce a synergistic combination of advanced technologies, including AI, IoT, blockchain, and novel materials, which are not anticipated by the original patent. The integration of these technologies enables real-time monitoring, personalized feedback, and optimized prosthesis placement, thereby providing a significant improvement over traditional joint replacement surgery.
Alternative Embodiments and Variations
Alternative embodiments may include the use of different AI algorithms, IoT protocols, or blockchain platforms. Variations may also include the integration of additional sensors or technologies, such as computer vision or robotics, to further enhance the system's capabilities.
Potential Commercial Applications and Market
The intelligent void filling joint prosthetics system has significant commercial potential in the orthopedic industry, with potential applications in hospitals, clinics, and surgical centers. The system's ability to enhance patient outcomes, reduce surgical time, and improve inventory management makes it an attractive solution for healthcare providers and manufacturers of orthopedic implants.
CPC Classifications
| Section | Class | Group |
|---|---|---|
| A | A61 | A61B17/1675 |
| A | A61 | A61B17/164 |
| A | A61 | A61B17/17 |
| A | A61 | A61B17/1764 |
| A | A61 | A61F2/30724 |
| A | A61 | A61F2/30734 |
| A | A61 | A61F2/30767 |
| A | A61 | A61F2/38 |
| A | A61 | A61F2/3859 |
| A | A61 | A61F2/461 |
| A | A61 | A61B2090/036 |
| A | A61 | A61B2090/062 |
| A | A61 | A61F2002/3021 |
| A | A61 | A61F2002/3069 |
| A | A61 | A61F2002/3093 |
| A | A61 | A61F2002/30332 |
| A | A61 | A61F2002/30736 |
Original Patent Information
| Patent Number | US 11,857,205 |
|---|---|
| Title | Void filling joint prosthesis and associated instruments |
| Assignee(s) | Howmedica Osteonics Corp. |