Enhanced Ultrasound Transducer Probe with Advanced Thermal Management and EMI Control
Legal Citation
Summary of the Inventive Concept
The present inventive concept relates to an improved ultrasound transducer probe with enhanced thermal management and electromagnetic interference (EMI) control, ensuring more efficient and reliable medical imaging.
Background and Problem Solved
The original patent disclosed an ultrasound transducer probe with thermally conductive fins or planar layers. However, the existing design still faces limitations in thermal management and EMI control, which can compromise image quality and probe durability. The new inventive concept addresses these limitations by introducing advanced thermal management systems and EMI control mechanisms.
Detailed Description of the Inventive Concept
The enhanced ultrasound transducer probe features a thermally conductive layer integrated with a return plane to reduce thermal resistance and improve heat dissipation. Additionally, the probe incorporates a Faraday cage with overlapping joints and EMI gaskets to minimize electromagnetic interference. The probe array assembly can be manufactured using 3D printing, enabling enhanced structural integrity and reduced production time. The probe's metal inner shell is overmolded with a transparent plastic cover, providing improved durability and resistance to damage. A thermal management system utilizing a combination of thermally conductive fins and a heat sink minimizes thermal buildup.
Novelty and Inventive Step
The new inventive concept's novelty lies in the integration of advanced thermal management systems and EMI control mechanisms, which provide a significant improvement over the original patent's design. The inventive step resides in the specific combination and implementation of these features, which result in a more efficient, reliable, and durable ultrasound transducer probe.
Alternative Embodiments and Variations
Alternative embodiments of the inventive concept could include the use of different thermally conductive materials, varied Faraday cage designs, or alternative manufacturing methods. Additionally, the thermal management system could be adapted for use in other medical imaging applications.
Potential Commercial Applications and Market
The enhanced ultrasound transducer probe has significant commercial potential in the medical imaging industry, particularly in applications requiring high-quality images and reliable probe performance. The target market includes hospitals, clinics, and medical research institutions.
CPC Classifications
| Section | Class | Group |
|---|---|---|
| A | A61 | A61B8/4444 |
| A | A61 | A61B8/4455 |
| A | A61 | A61B8/4494 |
| A | A61 | A61B8/546 |
| F | F28 | F28F3/048 |
Section 103 Obviousness Analysis (PHOSITA)
Field of Art
Medical ultrasound imaging technology, specifically ultrasound transducer design with thermal management and electromagnetic interference (EMI) control. Requires expertise in electrical engineering, thermal engineering, medical device design, and materials science with proficiency in medical imaging probe fabrication techniques.
Person of Ordinary Skill (PHOSITA) Profile
A skilled practitioner with advanced engineering degree, 3-5 years experience in medical imaging device design, familiar with thermal management strategies, EMI shielding techniques, and ultrasound transducer manufacturing processes
Obviousness Rationale
A PHOSITA would recognize that the PTD's disclosed variations represent predictable engineering improvements to the source patent's ultrasound probe design. The technical modifications involve standard engineering techniques for thermal management and EMI control that would be readily apparent to someone skilled in medical imaging device development. The specific combinations of thermally conductive layers, Faraday cage design, and manufacturing techniques represent incremental advancements using known methods in the field.
Obvious Combinations & Variations
Original Patent Information
| Patent Number | US 11,857,364 |
|---|---|
| Title | Ultrasound probe |
| Assignee(s) | FUJIFILM Sonosite, Inc. |