Intelligent Spinal Implant Assembly with Blockchain, IoT, AI, and Advanced Materials
Legal Citation
Summary of the Inventive Concept
An integrated spinal implant assembly that leverages blockchain for provenance tracking, IoT for real-time monitoring, AI for predictive maintenance, and novel materials for enhanced biocompatibility and strength.
Background and Problem Solved
The original patent, 'Spinal implant and assembly,' addressed the need for resilient and flexible arms in spinal implants. However, it did not account for the limitations of traditional materials, the lack of real-time monitoring, and the importance of data-driven decision-making in modern medicine. The new inventive concept addresses these limitations by integrating advanced technologies to create a more powerful, connected, and intelligent spinal implant assembly.
Detailed Description of the Inventive Concept
The new system comprises an implant assembly adapted to be received in an implant assembly receiving area between a first vertebra or bone and a second vertebra or bone. The implant assembly is integrated with a blockchain-based data storage system for tracking and verifying the implant's provenance and performance. Additionally, an IoT-enabled sensor system is integrated with the implant assembly to track and transmit data related to the implant's performance and surrounding tissue conditions. The implant assembly may also be fabricated from novel, high-strength, and biocompatible materials enabled by AI-optimized material science simulations. Furthermore, a machine learning algorithm trained on historical data and real-time sensor inputs from the implant assembly generates predictive analytics and alerts for proactive maintenance and replacement. The implant assembly may also be adapted for personalized medicine, comprising an implant member having a unique, AI-generated topology optimized for a specific patient's anatomy and condition.
Novelty and Inventive Step
The new claims introduce the integration of blockchain, IoT, AI, and advanced materials into the spinal implant assembly, which is not anticipated by the original patent. The synergistic combination of these technologies provides a new, more powerful system that addresses the limitations of traditional spinal implants.
Alternative Embodiments and Variations
Alternative embodiments may include variations in the blockchain architecture, IoT sensor configurations, AI algorithm designs, and material compositions. Additionally, the inventive concept could be adapted for use in other orthopedic or medical implant applications.
Potential Commercial Applications and Market
The intelligent spinal implant assembly has significant commercial potential in the orthopedic and medical device industries, with potential applications in personalized medicine, remote patient monitoring, and data-driven healthcare decision-making.
CPC Classifications
| Section | Class | Group |
|---|---|---|
| A | A61 | A61F2/4455 |
| A | A61 | A61F2/447 |
| A | A61 | A61F2002/30004 |
| A | A61 | A61F2002/30014 |
| A | A61 | A61F2002/30131 |
| A | A61 | A61F2002/30383 |
| A | A61 | A61F2002/30593 |
| A | A61 | A61F2002/30604 |
| A | A61 | A61F2002/30787 |
| A | A61 | A61F2002/30904 |
Original Patent Information
| Patent Number | US 11,857,434 |
|---|---|
| Title | Spinal implant and assembly |
| Assignee(s) | X-Spine Systems, Inc. |