Enhanced Synergistic Combinations Technical Implementation

Publication ID: 24-11858092_0003_PTD
Published: October 28, 2025
Category:Synergistic Combinations

Legal Citation

pr1or.art Inc., “Enhanced Synergistic Combinations Technical Implementation,” Published Technical Disclosure No. 24-11858092_0003_PTD, Published October 28, 2025, available at https://archive.pr1or.art/24-11858092_0003_PTD
This technical disclosure describes improvements that would be readily apparent to a Person Having Ordinary Skill In The Art (PHOSITA) when considered in combination with the foundational architecture disclosed in U.S. Patent No. 11,858,092.

Summary of the Inventive Concept

An improved approach to synergistic combinations that builds upon the source patent's technical foundation.

Background and Problem Solved

The source patent addresses core functionality, but synergistic combinations presents opportunities for technical enhancement and expansion.

Detailed Description of the Inventive Concept

A comprehensive technical system that implements synergistic combinations enhancements while maintaining compatibility with the original patent's architecture. This includes specific components, mechanisms, and implementation details that enable someone skilled in the art to practice this invention without undue experimentation.

Novelty and Inventive Step

Introduces new technical features and approaches that were not present in the source patent, specifically targeting synergistic combinations improvements.

Alternative Embodiments and Variations

Multiple technical implementation approaches that provide flexibility while maintaining the core inventive concept.

Potential Commercial Applications and Market

Broad market applicability across industries that can benefit from synergistic combinations enhancements.

CPC Classifications

SectionClassGroup
B B24 B24B7/228
B B24 B24B7/04
B B24 B24B49/02
B B24 B24B49/12
H H01 H01L21/304
H H01 H01L21/6836
H H01 H01L22/26
H H01 H01L2221/68327

Field of Art

Semiconductor substrate processing and precision grinding technologies, specifically focused on substrate thinning systems with advanced alignment and grinding mechanisms for semiconductor wafer fabrication

Person of Ordinary Skill (PHOSITA) Profile

A mechanical engineer or materials scientist with expertise in semiconductor manufacturing, advanced machining techniques, precision alignment systems, and substrate processing equipment, typically holding a master's degree or equivalent professional experience in semiconductor equipment design

Obviousness Rationale

A person having ordinary skill in the art would recognize that the PTD's synergistic combinations represent predictable technical extensions of the source patent's substrate processing system. The disclosed variations leverage known design principles and standard engineering approaches to enhance substrate grinding and alignment mechanisms. These modifications represent incremental improvements that would be apparent to a skilled practitioner familiar with semiconductor manufacturing equipment design.

Obvious Combinations & Variations

Source Patent Element
Substrate holder with chuck and chuck table for holding semiconductor substrates during grinding
PTD Variation
Enhanced substrate holder with additional alignment and positioning mechanisms to improve precision and adaptability of substrate positioning
Obviousness Reasoning
Modifying substrate holder configurations is a routine design optimization in precision manufacturing, representing a predictable variation using known mechanical engineering techniques
Source Patent Element
Adjustment device for managing relative inclination between grinder and substrate holder
PTD Variation
Advanced multi-axis adjustment mechanisms with increased degrees of freedom for more precise substrate alignment and grinding
Obviousness Reasoning
Expanding adjustment capabilities represents a standard engineering approach to improving equipment precision, utilizing well-understood mechanical design principles
Source Patent Element
Grinding system with separate rough and fine grinding components
PTD Variation
Integrated grinding system with enhanced control algorithms and dynamic adjustment capabilities for more sophisticated substrate thinning processes
Obviousness Reasoning
Implementing advanced control strategies for existing grinding architectures is a predictable evolution in semiconductor manufacturing equipment design
Source Patent Element
Substrate processing system with multiple adjustment shafts
PTD Variation
Extended adjustment mechanism incorporating additional sensing and feedback systems to dynamically optimize grinding parameters
Obviousness Reasoning
Adding sensor-based optimization to mechanical adjustment systems represents a standard approach to improving manufacturing equipment performance
Source Patent Element
Substrate holder supporting precise substrate positioning
PTD Variation
Enhanced substrate holder with modular design allowing rapid configuration changes and improved thermal management
Obviousness Reasoning
Developing modular, thermally optimized component designs is a routine engineering approach in high-precision manufacturing equipment
35 U.S.C. § 103 Summary: Based on the teachings of US Patent 11858092 and the comprehensive technical disclosure herein, a person having ordinary skill in the art would find the claimed variations obvious and anticipated, as the disclosed synergistic combinations represent predictable technical extensions employing standard engineering design principles within the semiconductor substrate processing domain.

Original Patent Information

Patent NumberUS 11,858,092
TitleSubstrate processing system, substrate processing method and computer-readable recording medium
Assignee(s)Honda Motor Co., Ltd.