Published Technical Disclosure Archive

Enhanced New Applications & Use Cases Technical Implementation

Publication ID: 24-11858092_0007_PTD
Published: October 28, 2025
Category:New Applications & Use Cases

Legal Citation

pr1or.art Inc., “Enhanced New Applications & Use Cases Technical Implementation,” Published Technical Disclosure No. 24-11858092_0007_PTD, Published October 28, 2025, available at https://archive.pr1or.art/24-11858092_0007_PTD
This technical disclosure describes improvements that would be readily apparent to a Person Having Ordinary Skill In The Art (PHOSITA) when considered in combination with the foundational architecture disclosed in U.S. Patent No. 11,858,092.

Summary of the Inventive Concept

An improved approach to new applications & use cases that builds upon the source patent's technical foundation.

Background and Problem Solved

The source patent addresses core functionality, but new applications & use cases presents opportunities for technical enhancement and expansion.

Detailed Description of the Inventive Concept

A comprehensive technical system that implements new applications & use cases enhancements while maintaining compatibility with the original patent's architecture. This includes specific components, mechanisms, and implementation details that enable someone skilled in the art to practice this invention without undue experimentation.

Novelty and Inventive Step

Introduces new technical features and approaches that were not present in the source patent, specifically targeting new applications & use cases improvements.

Alternative Embodiments and Variations

Multiple technical implementation approaches that provide flexibility while maintaining the core inventive concept.

Potential Commercial Applications and Market

Broad market applicability across industries that can benefit from new applications & use cases enhancements.

CPC Classifications

SectionClassGroup
B B24 B24B7/228
B B24 B24B7/04
B B24 B24B49/02
B B24 B24B49/12
H H01 H01L21/304
H H01 H01L21/6836
H H01 H01L22/26
H H01 H01L2221/68327

Field of Art

Semiconductor substrate processing and precision grinding technologies, specifically focused on wafer thinning systems with multi-axis adjustment mechanisms for precision machining in semiconductor manufacturing

Person of Ordinary Skill (PHOSITA) Profile

A mechanical engineer with expertise in semiconductor manufacturing equipment, advanced machining techniques, precision grinding systems, and familiarity with wafer processing technologies. Possesses advanced degree or equivalent professional experience in mechanical engineering or materials processing

Obviousness Rationale

A person skilled in the art would recognize that the PTD's disclosed variations represent predictable extensions of the source patent's substrate processing system. The technical improvements are consistent with known design optimization strategies in precision machining technologies. The proposed modifications would be considered routine engineering adaptations that a skilled practitioner could implement without undue experimentation.

Obvious Combinations & Variations

Source Patent Element
Substrate holder with chuck and chuck table for holding semiconductor substrates during grinding process
PTD Variation
Enhanced substrate holding mechanism with additional alignment and positioning features to improve substrate stability during processing
Obviousness Reasoning
Modifying substrate holding configurations is a predictable design choice for improving precision and reducing processing variations, which would be obvious to a skilled engineer
Source Patent Element
Adjustment device for managing relative inclination between grinder and substrate holder
PTD Variation
Advanced multi-axis adjustment mechanism with enhanced computational control for real-time alignment compensation
Obviousness Reasoning
Implementing more sophisticated alignment technologies represents a known technique for improving machining precision, utilizing standard control engineering principles
Source Patent Element
Rough and fine grinding stages for substrate thinning
PTD Variation
Integrated adaptive grinding process with dynamic parameter adjustment based on real-time material response measurements
Obviousness Reasoning
Implementing feedback-driven machining processes is a standard approach in precision manufacturing, representing an obvious optimization strategy
Source Patent Element
Multiple adjustment shafts for vertical movement of substrate holder periphery
PTD Variation
Enhanced shaft configuration with integrated sensing and compensation mechanisms for improved geometric accuracy
Obviousness Reasoning
Adding sensing capabilities to mechanical adjustment systems is a predictable evolution in precision engineering, representing a known technique for performance improvement
Source Patent Element
Substrate processing system with grinding configuration
PTD Variation
Extended system architecture supporting multiple substrate types and non-standard processing geometries
Obviousness Reasoning
Generalizing system capabilities to handle broader processing requirements represents a standard design approach in manufacturing equipment development
35 U.S.C. § 103 Summary: Based on the teachings of US Patent 11858092 and the disclosed technical variations, a person having ordinary skill in the art would find the claimed technical implementations obvious and anticipated. The proposed modifications represent predictable extensions of existing substrate processing technologies, utilizing known engineering techniques and design optimization strategies that would be readily apparent to a skilled practitioner in semiconductor manufacturing equipment design.

Original Patent Information

Patent NumberUS 11,858,092
TitleSubstrate processing system, substrate processing method and computer-readable recording medium
Assignee(s)Honda Motor Co., Ltd.