Enhanced Layered Image Pickup Device with Adaptive Signal Processing
Legal Citation
Summary of the Inventive Concept
An improved layered image pickup device featuring adaptive signal processing to optimize image quality, reduce noise, and enhance device efficiency
Background and Problem Solved
The original layered image pickup device, as described in the source patent, enables downsizing of device size while maintaining signal processing capability. However, it may still suffer from image quality degradation due to noise and limited processing power. The Enhanced Layered Image Pickup Device with Adaptive Signal Processing solves this problem by incorporating an adaptive noise reduction module, utilizing machine learning algorithms to optimize signal gain and offset in real-time, resulting in improved image quality and reduced noise.
Detailed Description of the Inventive Concept
The Enhanced Layered Image Pickup Device with Adaptive Signal Processing comprises a first structural body and a second structural body layered on top of each other. The first structural body includes a pixel array unit with 1280x720 photodiodes, each measuring 5.5μm x 5.5μm. The second structural body includes an input/output circuit unit, a signal processing circuit, and an adaptive noise reduction module. The adaptive noise reduction module utilizes a machine learning algorithm to analyze image data and adjust signal gain and offset in real-time, resulting in improved image quality and reduced noise. The signal processing circuit is implemented using a 65nm CMOS process, with a clock speed of 200MHz and power consumption of 50mW. The layered structure enables a 20% reduction in device size compared to conventional image pickup devices. The first and second structural bodies are connected using 10μm diameter through-vias spaced 20μm apart, with a total of 100 through-vias per device. External terminals include a 10-pin signal output terminal and a 5-pin power input terminal. The device operates on a 1.8V power supply, with a maximum operating temperature of 85°C.
Novelty and Inventive Step
The incorporation of an adaptive noise reduction module utilizing machine learning algorithms in the layered image pickup device is technically new and non-obvious compared to the source patent. The implementation of such a module requires careful consideration of signal processing, noise reduction, and real-time adjustment, making it a novel and inventive step beyond the original concept.
Alternative Embodiments and Variations
Alternative embodiments of the Enhanced Layered Image Pickup Device with Adaptive Signal Processing could include variations in the pixel array unit, such as different photodiode sizes or arrangements, or alternative machine learning algorithms for noise reduction. Additionally, the device could be implemented using different CMOS process sizes or clock speeds to optimize performance and power consumption.
Potential Commercial Applications and Market
The Enhanced Layered Image Pickup Device with Adaptive Signal Processing has significant commercial potential in industries such as smartphone manufacturing, digital photography, and surveillance systems, where high-quality image capture and processing are critical.
Section 103 Obviousness Analysis (PHOSITA)
Field of Art
Image Sensor and Semiconductor Device Design, focusing on layered image pickup devices with integrated signal processing circuits, requiring expertise in CMOS imaging technologies, semiconductor packaging, and signal processing algorithms
Person of Ordinary Skill (PHOSITA) Profile
A skilled electrical engineer with a master's degree in electrical engineering or semiconductor design, experienced in image sensor architectures, familiar with CMOS fabrication processes, signal processing techniques, and machine learning applications in semiconductor design
Obviousness Rationale
A person having ordinary skill in the art would recognize that integrating an adaptive noise reduction module using machine learning into a layered image pickup device represents a predictable extension of existing image sensor design principles. The source patent's layered structural approach provides a clear framework for incorporating advanced signal processing capabilities. The technical variations disclosed in the PTD represent incremental improvements using known semiconductor design techniques and machine learning approaches commonly applied in image sensor technologies.
Obvious Combinations & Variations
Original Patent Information
| Patent Number | US 121,660,602 |
|---|---|
| Title | Image pickup device and electronic apparatus |